At Robert McKeown Company, Inc. (RMC), we offer several lines of Parker Chomerics thermal products, including CHO-THERM® and THERMFLOW®.
CHO-THERM® Commercial Grade Thermal Insulator Pads are specially designed for use in applications requiring cost-effective solid thermal and electrical properties. If needed, these pads can also come with an additional adhesive layer for attachment; extra-layer CHO-THERM® materials are available die-cut on continuous rolls. Polyimide- or fiberglass-reinforced versions are also available to protect the pads from external stresses that can result in tears, cuts, and punctures. For applications that require the highest thermal, dielectric, and mechanical properties, CHO-THERM® High Power Insulator Pads are also offered.
THERMFLOW® phase change thermal interface materials, on the other hand, fill interfacial air gaps and voids entirely. These materials are designed specifically to maximize heat dissipation and component reliability. THERMFLOW® materials are solid, easy to handle, ensure consistent and clean application, and are easily conforming. Extremely versatile, they can be applied as dry pads to a heat sink or component surface, and their ability to completely fill air gaps essentially guarantees superior performance over any other thermal interface material. More detailed specifics on Parker Chomerics THERMFLOW® phase change thermal interface materials are available on their site.